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Norm
ÖVE/ÖNORM EN 62047-17
Issue date: 2016 02 01
Semiconductor devices - Micro-electromechanical devices -- Part 17: Bulge test method for measuring mechanical properties of thin films (IEC 62047-17:2015) (english version)
This part of IEC 62047 specifies the method for performing bulge tests on the free-standing
film that is bulged within a window. The specimen is fabricated with micro/na...
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Valid
Publisher:
Austrian Standards International
Format:
Digital | 36 Pages
Language:
English
Topics
IT, communication & electronic, Electromechanical components for electronic and telecommunications equipment, Electromechanical components in general
IT, communication & electronic, Electronic components, Other semiconductor devices
IT, communication & electronic, Electronic components, Semiconductor devices in general
Electric & lighting engineering, Electromechanical components for electronic and telecommunications equipment, Electromechanical components in general
This part of IEC 62047 specifies the method for performing bulge tests on the free-standing
film that is bulged within a window. The specimen is fabricated with micro/nano structural film
materials, including metal, ceramic and polymer films, for MEMS, micromachines and others.
The thickness of the film is in the range of 0,1 µm to 10 µm, and the width of the rectangular
and square membrane window and the diameter of the circular membrane range from 0,5 mm
to 4 mm.
The tests are carried out at ambient temperature, by applying a uniformly-distributed pressure
to the testing film specimen with bulging window.
Elastic modulus and residual stress for the film materials can be determined with this method.
ÖVE/ÖNORM EN 62047-17
2016 02 01
Semiconductor devices - Micro-electromechanical devices -- Part 17: Bulge test method for measuring...
Norm
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