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Norm

ÖVE/ÖNORM EN 60749-20

Issue date: 2010 05 01

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2008) (english version)

Withdrawn : 2023 10 01
Publisher:
Austrian Standards International
Format:
Digital | 36 Pages
Language:
English
Currently valid:
OVE EN IEC 60749-20:2023 08 01
ICS
31.080.01
Topics
IT, communication & electronic, Electronic components, Semiconductor devices in general
OVE EN IEC 60749-20
2023 08 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encaps...
Norm
OVE EN IEC 60749-20
2023 08 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encaps...
Norm
ÖVE/ÖNORM EN 60749-20
2010 05 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encaps...
Norm
↖
ÖVE/ÖNORM EN 60749-20
2004 01 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encaps...
Norm
Historie aufklappen
Norm
OVE EN IEC 60749-20
Issue date : 2023 08 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (german version)
Norm
OVE EN IEC 60749-20
Issue date : 2023 08 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (english version)