Please select and order
€232.70
excl. VAT
CONFIGURE NOW
Norm

ÖVE/ÖNORM EN 60749-20-1

Issue date: 2009 12 01

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 60749-20-1:2009) (english version)

Valid
Publisher:
Austrian Standards International
Format:
Digital | 40 Pages
Language:
English
ICS
31.080.01
Topics
IT, communication & electronic, Electronic components, Semiconductor devices in general
ÖVE/ÖNORM EN 60749-20-1
2009 12 01
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelli...
Norm
↖