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Norm
ÖVE/ÖNORM EN 60191-6-3
Issue date: 2001 08 01
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (IEC 60191-6-3:2000)
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Valid
Publisher:
Austrian Standards International
Format:
Digital | 16 Pages
Language:
German
ICS
NONE