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Norm

ÖVE/ÖNORM EN 60191-6-19

Issue date: 2010 11 01

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010) (english version)

Valid
Publisher:
Austrian Standards International
Format:
Digital | 22 Pages
Language:
English
ICS
31.080.01
Topics
IT, communication & electronic, Electronic components, Semiconductor devices in general
ÖVE/ÖNORM EN 60191-6-19
2010 11 01
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package ...
Norm
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