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Norm
OVE EN IEC 60749-20
Issue date: 2023 08 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (english version)
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of
semiconductors packaged as plastic encapsulated surface mount devices (SMDs). Th...
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Valid
Publisher:
Österreichischer Verband für Elektrotechnik
Format:
Digital | 66 Pages
Language:
English
ICS
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of
semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is
destructive.
OVE EN IEC 60749-20
2023 08 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encaps...
Norm
↖
ÖVE/ÖNORM EN 60749-20
2010 05 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encaps...
Norm
ÖVE/ÖNORM EN 60749-20
2010 05 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encaps...
Norm
ÖVE/ÖNORM EN 60749-20
2004 01 01
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encaps...
Norm