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Norm
OVE EN IEC 61190-1-3
Issue date: 2018 10 01
Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017) (english version)
This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder ...
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Valid
Publisher:
Österreichischer Verband für Elektrotechnik
Format:
Digital | 52 Pages
Language:
English
ICS
This part of IEC 61190 prescribes the requirements and test methods for electronic grade
solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for
electronic soldering applications and for "special" electronic grade solders. For the generic
specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control
document and is not intended to relate directly to the material's performance in the
manufacturing process.
Special electronic grade solders include all solders which do not fully comply with the
requirements of standard solder alloys and solder materials listed herein. Examples of special
solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy
solder powders.
OVE EN IEC 61190-1-3
2018 10 01
Attachment materials for electronic assembly -- Part 1-3: Requirements for electronic grade solder ...
Norm
↖
ÖVE/ÖNORM EN 61190-1-3
2011 05 01
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder al...
Norm
ÖVE/ÖNORM EN 61190-1-3
2007 12 01
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder al...
Norm
ÖVE/ÖNORM EN 61190-1-3
2003 05 01
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder al...
Norm