NORM
OVE EN IEC 61189-5-601
Issue date: 2023 01 01
Test methods for electrical materials, printed boards and other interconnection structures and assemblies -- Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards ((IEC 61189-5-601:2021) EN IEC 61189-5-601:2021)
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